The modern silicon wafer is a high-performance engineered product, whether used for advanced microprocessors, memory or power controllers. Through development partnerships, SUMCO prudently invests in technology advancement to provide customers with "best-in-class" silicon wafer products. We are constantly developing and implementing new production techniques, designed to meet our customers' anticipated future standards.

SUMCO customers have access to a broad menu of technologies for all wafer diameters, as well as technology bridges to transition to tighter geometries (110 and 90 nanometer) and larger diameters (from 200 to 300mm).

Bridging to 300mm production

SUMCO initially was formed several years ago as a joint venture between the Sumitomo and Mitsubishi silicon divisions. Its sole purpose was to build integrated production capabilities for next-generation, 300mm silicon wafers. By leveraging its combined strengths and the best solutions from both companies, SUMCO is now making production volumes of 300mm wafers.

To address the issue of transitioning from 200 mm to 300mm, SUMCO offers a variety of bridge technologies such as:

SUMCO offers unique capabilities in technology specialization, designed to help semiconductor manufacturers improve device performance and increase their yields.

Using advanced crystal-growing techniques, we manufacture very low resistivity wafers in sizes up to 200mm for high efficiency power management applications, such as mobile communications or computers, discrete parts and power management circuits. SUMCO's Technology Center is advancing the state-of-the-art of heavily-doped crystal growing, both p-type and n-type, to support epi wafer products.

As semiconductor applications get more sophisticated, tailoring bulk material properties becomes increasingly critical to device performance and yield. We are helping our customers achieve improved bulk materials performance by engineering bulk micro defects in polished wafers and epitaxial wafer substrate. iGem™ 

SUMCO manufactures a wide range of epitaxial wafer products for CMOS and power discrete applications.

Our polished wafer capabilities are state-of-the-art, with geometries of 110 or 90 nm.